JPH0525399B2 - - Google Patents
Info
- Publication number
- JPH0525399B2 JPH0525399B2 JP62205478A JP20547887A JPH0525399B2 JP H0525399 B2 JPH0525399 B2 JP H0525399B2 JP 62205478 A JP62205478 A JP 62205478A JP 20547887 A JP20547887 A JP 20547887A JP H0525399 B2 JPH0525399 B2 JP H0525399B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- medium
- composite substrate
- sheet
- ceramic composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62205478A JPS6447099A (en) | 1987-08-18 | 1987-08-18 | Ceramic composite substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62205478A JPS6447099A (en) | 1987-08-18 | 1987-08-18 | Ceramic composite substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6447099A JPS6447099A (en) | 1989-02-21 |
JPH0525399B2 true JPH0525399B2 (en]) | 1993-04-12 |
Family
ID=16507519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62205478A Granted JPS6447099A (en) | 1987-08-18 | 1987-08-18 | Ceramic composite substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6447099A (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7742276B2 (en) * | 2007-03-30 | 2010-06-22 | Industrial Technology Research Institute | Wiring structure of laminated capacitors |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3977887A (en) * | 1974-03-08 | 1976-08-31 | International Business Machines Corporation | High dielectric constant ceramics which can be sintered at low temperatures |
JPS5817651A (ja) * | 1981-07-24 | 1983-02-01 | Hitachi Ltd | 多層回路板とその製造方法 |
JPS5917232A (ja) * | 1982-07-20 | 1984-01-28 | 日本電気株式会社 | 複合積層セラミツク部品およびその製造方法 |
JPS59132114A (ja) * | 1983-01-18 | 1984-07-30 | 松下電器産業株式会社 | 積層セラミツクコンデンサ |
JPS6088420A (ja) * | 1983-10-21 | 1985-05-18 | 日本電気株式会社 | 複合積層セラミツク部品 |
-
1987
- 1987-08-18 JP JP62205478A patent/JPS6447099A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6447099A (en) | 1989-02-21 |
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